GlobalFoundries and Taiwan Semiconductor Manufacturing Company (TSMC) have announced a five-year manufacturing agreement valued at $21 billion to establish a U.S.-based supply of silicon interposers. Under the deal, GlobalFoundries will produce these critical components at its fabrication plant in Malta, New York, supporting TSMC’s advanced chip packaging platform known as CoWoS (Chip-on-Wafer-on-Substrate).
Silicon interposers are essential for advanced semiconductor packaging, particularly for high-performance computing and artificial intelligence (AI) applications. They enable the integration and communication of multiple chip components within a single package, enhancing performance and efficiency.
The agreement marks a significant step toward strengthening the domestic U.S. supply chain for semiconductors used in AI and other demanding technologies. Volume production of silicon interposers at the Malta fab is projected to ramp up in the first half of 2028.
While the $21 billion figure represents the overall business value over the term of the agreement, specific production volumes and capital investment details have not been publicly disclosed. Importantly, GlobalFoundries will focus on manufacturing the silicon interposers themselves and not TSMC’s leading-edge processor chips. This collaboration positions GlobalFoundries as a strategic manufacturing partner within TSMC’s advanced packaging ecosystem.
By enabling a robust U.S.-based supply for a key semiconductor component, this deal could support growth in American semiconductor manufacturing capacity and help address supply chain vulnerabilities. The agreement also reflects industry trends emphasizing localized production of critical technology components to meet rising demand for AI and high-performance computing hardware.
